70Khz Ultrasonic Wire Coil Embedding Machine for IC Memory Card
The existing ultrasonic embedding wire embossing machine basically adopts a professional motion controller with a high-speed CPU to ensure the high-speed response of complicated mechanical actions and complete complex multi-axis motion control so as to realize the precision embedding of complex products. The vacuum suction plate Absorbing material embedding, effectively ensure the accuracy of the antenna embedding a smooth; embedding thread buried by ultrasonic technology, the entire process of program control fully automatic operation, easy operation, stable and reliable operation; using two automatic cycle switching workbench Plate, refueling without downtime, high production efficiency; each group of buried wire antenna group are independent units, both at the same time, you can also choose one of the groups at the same time work, high flexibility. Winding process than the traditional winding machine to be fast, save manpower, and more stable performance.
Compare with etching antenna technology:
Ultra-thin IC card is made possible by ultrasonic embedding process.It will effectively solve the problem of the failure of etching antenna technology in the application of ultra-thin IC card, which can reduce the scrap rate and reuse cost.The ultra-thin IC card produced by using the ultrasonic embedding process is the same as the IC card manufactured by the traditional process, so its average service life will be longer than the ultra-thin IC card produced by using the etching antenna (6 years) process. Two different processes, the material difference is mainly in the antenna part, the antenna material used in the etching antenna process is a PET (polyethylene terephthalate, PET) sheet with a thickness of 0.078 mm and a precision etched aluminum wire, and Ultrasound embedding process antenna for enameled copper wire, the same production performance of an IC card, according to the material price of etching antenna price is about 2 times the price of copper, so the use of ultrasonic embedding process to produce ultra-thin IC card The price is also slightly better. The mass production of ultra-thin IC CARDS will have a profound impact on the continuous development of the smart card industry.
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