High Frequency 70K Ultrasonic Welding System For Card Core Wire Inlay

High Frequency 70K Ultrasonic Welding System For Card Core Wire Inlay

High Frequency 70K Ultrasonic Welding System For Card Core Wire Inlay Description: With the development of subway transportation, ultra-thin IC cards are increasing, and ultra-thin IC cards (thickness 0.48-0.52mm) are produced by etched antenna technology. In actual use, the failure rate is...

High Frequency 70K Ultrasonic Welding System For Card Core Wire Inlay




Description: 

With the development of subway transportation, ultra-thin IC cards are increasing, and ultra-thin IC cards (thickness 0.48-0.52mm) are produced by etched antenna technology. In actual use, the failure rate is high, and the average life expectancy is only 3 year. With the continuous development of thinning chips and the continuous improvement of ultrasonic embedding technology, ultra-thin IC cards are made possible by ultrasonic embedding process.



Specification:

Model: HSW70

Frequency: 70K 

Power: 100W 

Out Housing: Aluminum 

The threading hore: Customized 

Generator: Digital generator 

Power cord: 5 meters 



Competitive Advantages:

1. Before each product is shipped, the technical engineer will test the technical parameters and strictly control the quality.

2. With strong technical support, technical engineers constantly upgrade their ultrasonic products and explore new applications. 

3. Our company can customize the most suitable ultrasonic products according to the requirements of customers and recommend the best solution.



Application: 

1. Provide a range of flexible and efficient machine solutions for handling secure eIDs (e-passports, eID cards, electronic health cards).

2. Widely used in the field of electronic payment and the contactless card market.


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