Rotary Ultrasonic Machining RUM for Milling and Drilling
Ultrasonic machining is a low material removal rate (MRR), loose abrasive machining process in which the mirror image of a shaped tool can be created in hard, brittle materials.
Material removal begins with a vibrating tool. The vibration propels particles at accelerations in excess of 25,000 g’s. These dynamic particles collide with and grind the workpiece on a micro level.
Item No.: HS-M20
Amplitude: 10um or more
Diameter of Horn:
Spindle: BT40 / BT50 / R8 / HSK63 / ISO / CAT
(Special spindles are made per request.)
1. The process is non-thermal, non-chemical, and non-electrical, leaving the chemical and physical properties of the workpiece This low-stress process translates into high reliability for your critical applications.
1). Multiple features can be machined at the wafer or substrate level simultaneously, and the process is Our process is often the highest quality and lowest cost solution.
2). Ultrasonic machined features have vertical side walls, enabling you to preserve valuable space for your designs that translate into higher productivity.
2. The process integrates well with semiconductor and MEMS Machined features can be aligned to previously patterned, machined, or etched substrates.
Ultrasonic machining is suitable for machining of hard, brittle materials including:
CVD Silicon Carbide
Ceramic Matrix Composites